With its stainless steel wire, the diamond wire saw cuts most materials.
It is particularly recommended for cutting delicate/brittle samples such as silicon, glass or electronic components.
Low speeds allow samples to be cut whilst protecting materials and preventing overheating.
Ensuring flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.
Also, its sample clamping system avoids any dimensional distortion and its horizontal / vertical working modes
make cutting easier.
Cutting depth maximum in mm : 35/52
12 month warranty (excluding wear parts)
Turntable with 5 ceramic pads Ø 30 mm
Micrometer Table Drum with 10 meters of diamond wire
Standard sample holder with 5 ceramic pads Ø 30 mm
Cross table Cutting liquid concentrate 5 % - 500 ml
Stainless steel tub (for 3500)
Shipping brackets (set of 2)
Clip-On LED Lamp